PCB Assemblies

Isotech offers a broad range of solutions for PCB design and assembly. PCB production services are flexible, based on the customer needs, and can handle low and high volume production of both high and low-mix products with equal efficiency. Throughout the design, assembly and testing stages, quality holds the highest priority. This is evident from the fact that PC board Assemblies are inspected to IPC-610C.

Capabilities

• Complex double-sided PCB assembly
• Ball grid array
• In circuit and functional testing
• High complex assembly
• High mix, low volume assembly
• Back planes
• SMT placement capabilities
• Through-hole and mixed technology assembly

Surface Mount Technology

Isotech offers a wide range of services for customers seeking expertise in the Surface Mount Technology depending on their preference. Both single or dual side SMT assemblies as well as mixed technology for simple SMT assemblies to highly integrated combinations are available.

Production capabilities include:

• Pin-through-hole technology
• Ball-grid array (BGA) and mBGA
• Flip chip capability
• Fine-pitch - 12 mil pitch
• 0402 components
  

Ball Grid Array

Ball grid arrays, which fall under the category of Surface Mount Technology, have reduced the co-planarity and placement problems. It has better performance characteristics with regard to thermal and electrical characteristics. Though BGA is considered as a low cost alternative to fine pitch leaded surface mount, it offers specific advantages.

• Reduced handling problems
• Higher board assembly yields
• Quick design to product cycle time